Richard Fung, M.Eng., P.Eng.
Richard has held various roles over the last 19 years in both technical and management, with emphasis on analog/mixed-signal design and PHY designs. During his times at ATI/AMD, he led an analog/mixed-signal design team developing designs from high-voltage tolerant IOs, to MIPI CSI/DSI DPHY, to GDDR5 PHY. He also led the ESD working group on state-of-the-art GPU/APU products, establishing design and debug guidelines for GPU products.
He began participation in the Displayport workgroup in 2006, and was responsible for specification development up to version 1.0. With Displayport 1.2, Mr. Fung was the technical lead responsible for driving the electrical workgroup for the Fast Aux portion of the standard.
Richard received his B.A.Sc. and M.Eng. degrees in electrical engineering from the University of Toronto in 2000 and 2008 respectively. He has been granted 9 US patents.
Ricky Lau, M.Eng
Ricky is a semiconductor veteran with 17 years of experience in SoC architecture and mixed-signal design. His extensive knowledge of SoC architecture and ASIC design methodology has allowed him to lead multiple PHY and mixed-signal designs at ATI , AMD and Synopsys. His portfolio of design include DDR2/3/4/5 PHY, GDDR5 PHY, MIPI D-PHY, and dynamic frequency scaling circuits for CPU and GPU cores. He was also a contributing member of the MIPI Alliance PHY workgroup, where the D-PHY and M-PHY specifications were developed.
Ricky received his B.A.Sc. And M.Eng. degrees in Electrical Engineering from the University of Toronto in 2003 and 2007 respectively.
Ron Chan, M.Sc., P.Eng., SMIEEE
Ron has been an analog mixed-signal IC design engineer with various leading edge high tech companies in several countries for the past 18 years, with specialization in PLL, DLL, CDR, ADC, DAC and LDO designs. With over 170 tapeouts and over 20 million designed IC sold and produced, he is a seasoned veteran in the industry with extensive knowledge in design flow, design for manufacturing and design qualification with multiple foundries.
He received his B.A.Sc degree in Electrical Engineering from the University of Waterloo in 2001 and his M.Sc in IC Design Engineering from the Hong Kong University of Science and Technology in 2010. He is a Professional Engineer from the Province of Ontario in Canada since 2004 and is also a senior member of IEEE since 2015. He has been granted 3 US patents.